Interface Bonding Quality for Delamination Resistance in Laminated Glass Systems: Comparative Testing

Authors

  • Rachel A. Richardson Walker Department of Mechanical Engineering, Cockrell School of Engineering, The University of Texas at Austin, Austin, Texas, USA Author
  • Daniel C. Young Walker Department of Mechanical Engineering, Cockrell School of Engineering, The University of Texas at Austin, Austin, Texas, USA Author

Keywords:

Laminated Glass, Interfacial Bonding, Delamination Resistance, Polymeric Interlayers, Structural Engineering

Abstract

Laminated glass systems are widely utilized in modern architectural and structural engineering due to their enhanced safety, acoustic damping, and post-breakage load-bearing capacities. The structural integrity and durability of these composite systems are intrinsically linked to the interfacial bonding quality between the glass plies and the polymeric interlayer. This paper presents a comprehensive comparative analysis investigating the fundamental relationship between interface bonding characteristics and delamination resistance across different laminated glass configurations. By evaluating three primary interlayer materials, specifically Polyvinyl Butyral, SentryGlas ionomer, and Ethylene Vinyl Acetate, this study seeks to elucidate how variations in chemical adhesion and physical interlocking affect the macroscopic fracture energy required to propagate delamination. A rigorous experimental methodology is employed, encompassing standardized peel tests and compressive shear evaluations, followed by cyclic environmental conditioning to simulate long-term weathering. The findings demonstrate a pronounced correlation wherein higher initial interfacial shear strength translates directly into superior delamination resistance, although this relationship is non-linear and highly dependent on the viscoelastic properties of the specific polymer under varying temperatures and humidity levels. The insights generated from this research provide critical empirical evidence for optimizing lamination parameters and selecting appropriate interlayer materials in structural applications.

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Published

2026-01-23

Issue

Vol. 1 No. 1 (2026)

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